Flexible display apparatus

ABSTRACT

A flexible display apparatus includes: a substrate; a gate insulating layer including an inorganic layer disposed on the substrate; a gate line disposed on the gate insulating layer; an inter-insulating layer including an inorganic layer and covering the gate line; and a data line disposed on the inter-insulating layer, where the flexible display apparatus has a first region which is bendable and second regions at opposite sides of the first region, respectively, portions of the gate insulating layer and the inter-insulating layer in the first region are removed, and the gate insulating layer and the inter-insulating layer in the second region have a patterned structure.

This application is a continuation of U.S. patent application Ser. No.16/732,689, filed on Jan. 2, 2020, which is a continuation of U.S.patent application Ser. No. 15/944,051, filed on Apr. 3, 2018, which isa continuation of U.S. patent application Ser. No. 15/156,874, filed onMay 17, 2016, which claims priority to Korean Patent Application No.10-2015-0130597, filed on Sep. 15, 2015, and all the benefits accruingtherefrom under 35 U.S.C. § 119, the content of which in its entirety isherein incorporated by reference.

BACKGROUND 1. Field

One or more exemplary embodiments relate to a flexible displayapparatus.

2. Description of the Related Art

As information technology has developed, the market for displayapparatuses that are connecting media between users and information isincreasing. Accordingly, usage of flat panel displays (“FPD”s), such asliquid crystal displays (“LCD”s), organic light-emitting diodes(“OLED”s), and plasma display panels (“PDP”s) have increased.

If a display apparatus has flexibility, the display apparatus isportable in a state of being curved, folded, or rolled, and accordingly,portability may be ensured while increasing a screen size of the displayapparatus.

Accordingly, research on commercializing a display apparatus including aflexible display panel has recently increased.

SUMMARY

One or more exemplary embodiments include a flexible display apparatus.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to an exemplary embodiment, a flexible display apparatusincludes: a substrate; a gate insulating layer including an inorganiclayer and disposed on the substrate; a gate line disposed on the gateinsulating layer; an inter-insulating layer including an inorganic layerand covering the gate line; and a data line disposed on theinter-insulating layer, where the flexible display apparatus has a firstregion which is bendable and second regions at opposite sides of thefirst region, respectively, portions of the gate insulating layer andthe inter-insulating layer in the first region are removed, and the gateinsulating layer and the inter-insulating layer in the second regionhave a patterned structure.

In an exemplary embodiment, the data line may include aluminum (Al).

In an exemplary embodiment, the data line may be disposed directly onthe substrate, and the data line disposed in the first region mayconnect portions of the gate line in the second regions, respectively.

In an exemplary embodiment, the flexible display apparatus may furtherinclude a metal dam at an edge of each of the second regions, where themetal dam may be spaced from the data line with a predetermined distanceapart.

In an exemplary embodiment, the metal dam and the data line may bedisposed in a same layer and include a same material as each other.

In an exemplary embodiment, the flexible display apparatus may furtherinclude a via layer including an organic layer and covering the dataline, where a portion of the via layer in a third region, which isbetween an end portion of the data line and the metal dam within eachsecond region, is removed.

In an exemplary embodiment, the flexible display apparatus may furtherinclude: a pixel defining layer disposed on the via layer; and a spacerdisposed on the pixel defining layer.

In an exemplary embodiment, portions of the pixel defining layer and thespacer in a region from the first region to the third region may beremoved, and the pixel defining layer and the spacer may be disposed tooverlap only the metal dam and a region inside the metal dam in thesecond region.

In an exemplary embodiment, portions of the pixel defining layer and thespacer in the third region may be removed to overlap the second regionexcept the first region and the third region.

In an exemplary embodiment, the flexible display apparatus may furtherinclude a thin film encapsulation portion disposed on the spacer.

In an exemplary embodiment, the thin film encapsulation portion may bedisposed on the substrate, and the data line, the via layer and the thinfilm encapsulation portion may be sequentially disposed on the substratein the first region.

In an exemplary embodiment, the thin film encapsulation portion may bedisposed on the substrate entirely in the second region, except thefirst region.

In an exemplary embodiment, the flexible display apparatus may furtherinclude: a via layer including an organic material and disposed on thedata line; and a pixel electrode on the via layer, where a portion ofthe via layer on the data line in the second region is removed.

In an exemplary embodiment, the pixel electrode may be disposed on thevia layer in the first region, and the pixel electrode may connectportions of the data line in the second regions, respectively.

In an exemplary embodiment, the flexible display apparatus may furtherinclude a molding portion disposed on the via layer in the first region,on which the thin film encapsulation portion is removed, where themolding portion may include a waterproof coating agent.

In an exemplary embodiment, the flexible display apparatus may furtherinclude a touch screen panel (“TSP”) line disposed on the via layer inthe first region, in which the thin film encapsulation portion isremoved, and a TSP protective organic layer disposed on the TSP line.

In an exemplary embodiment, the gate insulating layer and theinter-insulating layer in a bendable portion of the second region areremoved, and portions of the gate insulating layer and theinter-insulating layer only on regions, where the gate line and the dataline are to be insulated in the second region, have a patternedstructure.

According to another exemplary embodiment, a flexible display apparatusincludes: a substrate; a gate insulating layer including an inorganiclayer and disposed on the substrate; a gate line disposed on the gateinsulating layer; an inter-insulating layer including an inorganic layerand covering the gate line; and a data line disposed on theinter-insulating layer. In such an embodiment, the flexible displayapparatus has a first region which is bendable and second regions atopposite sides of the first region, respectively, the gate insulatinglayer and the inter-insulating layer in the second region have apatterned structure, and a portion of the data line in the first regionis disposed directly on the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other features will become apparent and more readilyappreciated from the following description of the exemplary embodiments,taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a schematic plan view of a flexible display apparatusaccording to an exemplary embodiment;

FIG. 2 is a schematic cross-sectional view of an internal portion of asecond region in the flexible display apparatus of FIG. 1;

FIG. 3 is a schematic cross-sectional view of edges of a first regionand a second region in the flexible display apparatus according to anexemplary embodiment;

FIG. 4 is a cross-sectional view of a first region in a flexible displayapparatus according to an alternative exemplary embodiment;

FIG. 5 is a cross-sectional view of a first region in a flexible displayapparatus according to another alternative exemplary embodiment;

FIG. 6 is a cross-sectional view of a first region in a flexible displayapparatus according to another alternative exemplary embodiment;

FIG. 7 is a cross-sectional view of a first region in a flexible displayapparatus according to another alternative exemplary embodiment; and

FIG. 8 is a cross-sectional view of a first region in a flexible displayapparatus according to another alternative exemplary embodiment.

DETAILED DESCRIPTION

As the inventive concept allows for various changes and numerousembodiments, particular embodiments will be illustrated in the drawingsand described in detail in the written description. However, this is notintended to limit the inventive concept to particular modes of practice,and it is to be appreciated that all changes, equivalents, andsubstitutes that do not depart from the spirit and technical scope areencompassed in the inventive concept. In the description, certaindetailed explanations of the related art are omitted when it is deemedthat they may unnecessarily obscure the essence of the inventiveconcept.

While such terms as “first,” “second,” etc., may be used to describevarious components, such components must not be limited to the aboveterms. The above terms are used only to distinguish one component fromanother. Thus, “a first element,” “component,” “region,” “layer” or“section” discussed below could be termed a second element, component,region, layer or section without departing from the teachings herein.

The terms used in the present specification are merely used to describeparticular embodiments, and are not intended to limit the inventiveconcept. An expression used in the singular encompasses the expressionof the plural, unless it has a clearly different meaning in the context.In the present specification, it is to be understood that the terms suchas “including,” “having,” and “comprising” are intended to indicate theexistence of the features, numbers, steps, actions, components, parts,or combinations thereof disclosed in the specification, and are notintended to preclude the possibility that one or more other features,numbers, steps, actions, components, parts, or combinations thereof mayexist or may be added.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms, including “at least one,” unless the content clearly indicatesotherwise. “Or” means “and/or.” As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items. Expressions such as “at least one of,” when preceding alist of elements, modify the entire list of elements and do not modifythe individual elements of the list.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or“top,” may be used herein to describe one element's relationship toanother elements as illustrated in the Figures. It will be understoodthat relative terms are intended to encompass different orientations ofthe device in addition to the orientation depicted in the Figures. Forexample, if the device in one of the figures is turned over, elementsdescribed as being on the “lower” side of other elements would then beoriented on “upper” sides of the other elements. The exemplary term“lower,” can therefore, encompasses both an orientation of “lower” and“upper,” depending on the particular orientation of the figure.Similarly, if the device in one of the figures is turned over, elementsdescribed as “below” or “beneath” other elements would then be oriented“above” the other elements. The exemplary terms “below” or “beneath”can, therefore, encompass both an orientation of above and below.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” can mean within one or morestandard deviations, or within ±30%, 20%, 10%, 5% of the stated value.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

Exemplary embodiments are described herein with reference to crosssection illustrations that are schematic illustrations of idealizedembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, embodiments described herein should not beconstrued as limited to the particular shapes of regions as illustratedherein but are to include deviations in shapes that result, for example,from manufacturing. For example, a region illustrated or described asflat may, typically, have rough and/or nonlinear features. Moreover,sharp angles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

Hereinafter, exemplary embodiments of the invention will be described indetail with reference to the accompanying drawings.

FIG. 1 is a schematic plan view of a flexible display apparatus 1000according to an exemplary embodiment, FIG. 2 is a schematiccross-sectional view showing an internal portion of a second region D inthe flexible display apparatus 1000, and FIG. 3 is a schematiccross-sectional view of edge portions of a first region B and the secondregion D in the flexible display apparatus 1000.

The flexible display apparatus 1000 according to an exemplary embodimentincludes a first region B and second regions D.

The first region B is a bending region, at which a display panel isbendable or foldable by an angle of 90° or greater, and the secondregions D are flat regions in which a display unit 200 is included.

In an exemplary embodiment, as shown in FIG. 1, two second regions D maybe disposed at opposite sides of the first region B, based on the firstregion B. In such an embodiment, the display panel may be bent at thefirst region B, and the two second regions D disposed at opposite sidesof the first region B may display images to be shown.

In such an embodiment, the flexible display apparatus 1000 may include athird region I disposed on an edge portion of each of the second regionsD.

The third region I may be defined by an external portion of the secondregion D that is adjacent to the first region B.

Alternatively, an organic layer may be removed on the third region I,which will be described later.

Hereinafter, a cross-section of the first region B and an internalcross-section of the display unit 200 located in the second region Dwill be described below with reference to FIGS. 1 to 3. The display unit200 emits visible light corresponding to the image to be shown. Thedisplay unit 200 may include various devices, for example, an organiclight-emitting display diode (“OLED”) and a liquid crystal display(“LCD”) device. In an exemplary embodiment of the flexible displayapparatus 1000, the display unit 200 includes an organic light-emittingdiode OLED, as shown in FIG. 2.

The substrate 100 may include various materials, for example, a glassmaterial, other insulating materials, or a metal thin film.

Alternatively, the substrate 100 may include a flexible material, forexample, an organic material.

Alternatively, the substrate 100 may include at least one selected froma silicon-based polymer, polyurethane, polyurethane acrylate, acrylatepolymer, and acrylate terpolymer. In such an embodiment, thesilicon-based polymer may include, for example, polydimethylsiloxane(“PDMS”) and hexamethyldisiloxane (“HMDSO”).

According to an exemplary embodiment of the flexible display apparatus1000, the substrate 100 is fabricated to have a flexible property toelongate two-dimensionally.

Alternatively, the substrate 100 may include a material having aPoisson's ratio of about 0.4 or greater. The Poisson's ratio denotes aratio of compression in one direction when a material is elongated bybeing pulled in the other direction. When the material forming thesubstrate 100 has a Poissons's ratio of about 0.4 or greater, that is,the substrate 100 is sufficiently expanded, the flexibility of thesubstrate 100 may be improved and a bending portion may be defined bythe substrate 100. In such an embodiment, the display apparatus 1000 mayeffectively include the bending portion.

A buffer layer 110 may be disposed on the substrate 100. The bufferlayer 110 may function as a barrier layer and/or a blocking layer thateffectively prevents dispersion of impurity ions and infiltration ofmoisture or external air, and that planarizes a surface of the substrate100.

Alternatively, the buffer layer 110 may include an inorganic layer, andmay cover only the second regions D. In such an embodiment, the bufferlayer 110 including the inorganic material may be disposed on thesubstrate 100 and patterned to overlap only the second regions D and toexpose the first region B.

A thin film transistor TFT may be disposed on the buffer layer 110. Anactive layer A of the thin film transistor TFT may include polysilicon,and may include a channel region on which impurities are not doped, anda source region and a drain region disposed on opposite sides of thechannel region and doped with impurities. Here, the impurities may varydepending on the thin film transistor TFT, e.g., may be N-typeimpurities or P-type impurities.

In such an embodiment, a gate insulating layer 210 may be disposed onthe active layer A.

The gate insulating layer 210 may have a multi-layered or asingle-layered structure including an inorganic material such as siliconoxide or silicon nitride. The gate insulating layer 210 insulates a gateelectrode G disposed thereon from the active layer A.

Alternatively, the gate insulating layer 210 including the inorganicmaterial may be patterned to overlap only the second regions D, and toexpose the first region B.

In such an embodiment, the gate electrode G may be disposed on the gateinsulating layer 210. In an exemplary embodiment, the gate electrode Gmay be fabricated by a photolithography process and an etching process.

The gate electrode G may include at least one selected from molybdenum(Mo), aluminium (Al), platinum (Pt), palladium (Pd), silver (Ag),magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir),chrome (Cr), lithium (Li), calcium (Ca), titanium (Ti), tungsten (W),and copper (Cu).

In such an embodiment, an inter-insulating layer 230 is disposed on thegate insulating layer 210. In an exemplary embodiment, theinter-insulating layer 230 may be patterned to overlap only the secondregions D.

The inter-insulating layer 230 may include an inorganic material. In anexemplary embodiment, the inter-insulating layer 230 may include a metaloxide or a metal nitride. In one exemplary embodiment, for example, theinorganic material may include at least one selected from silicon oxide(SiO₂), silicon nitride (SiNx), silicon oxynitride (SiON), aluminiumoxide (Al₂O₃), titanium oxide (TiO₂), tantalum oxide (Ta₂O₅), hafniumoxide (HfO₂), or zinc oxide (ZrO₂).

The inter-insulating layer 230 may have a multi-layered or asingle-layered structure including an inorganic material such as siliconoxide (SiOx) and/or silicon nitride (SiNx). In some exemplaryembodiments, the inter-insulating layer 230 may have a dual-layerstructure such as SiOx/SiNy or SiNx/SiOy.

Alternatively, the flexible display apparatus 1000 may include the gateinsulating layer 210 and the inter-insulating layer 230, both of whichmay include a single-layered or multi-layered structure including theinorganic material. In such an embodiment, the gate insulating layer 210and the inter-insulating layer 230 may be patterned to overlap only thesecond region D, and to expose the first region B that is bendable.

A source electrode S and a drain electrode D of the thin film transistorTFT may be disposed on the inter-insulating layer 230.

The source electrode S and the drain electrode D may include at leastone metal material selected from Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr,Li, Ca, Mo, Ti, W, and Cu.

Alternatively, the source electrode S and the drain electrode D mayinclude Al that may improve flexural properties when forming data linesSD of the first region B, and will be described in greater detail later.

A via layer 250 may be disposed on the inter-insulating layer 230 tocover the source electrode S and the drain electrode D on theinter-insulating layer 230. A pixel electrode 271 may be disposed on thevia layer 250. According to an exemplary embodiment, as illustrated inFIG. 2, the pixel electrode 281 is connected to the drain electrode Dvia a via hole defined in the via layer 250.

The via layer 250 may include an insulating material. In one exemplaryembodiment, for example, the via layer 250 may have a single-layered ora multi-layered structure including an inorganic material, an organicmaterial, or an organic/inorganic compound material, provided by usingvarious deposition methods. In some exemplary embodiments, the via layer250 may include at least one selected from an polyacrylates resin, anepoxy resin, a phenolic resin, a polyamides resin, a polyimides resin,an unsaturated polyesters resin, a poly phenylenethers resin, a polyphenylenesulfides resin, and benzocyclobutene (“BCB”).

Alternatively, the via layer 250 may include an organic material, andmay be patterned in the first region B and the second regions D.However, if the via layer 250 including the organic material is disposedon the entire surface of the second regions D, a path of supplyingmoisture to the organic light-emitting diode OLED may be provided due tothe organic material.

Therefore, in some exemplary embodiments, where the via layer 250, isthe organic layer, a portion of the via layer 250 on the third region Ithat is formed at an edge of the second region D as shown in FIGS. 1 to3 is removed, and then, the via layer 250 may be disposed to overlaponly the second regions D and to expose the first region B and the thirdregion I. This will be described in detail later.

The organic light-emitting diode OLED may be disposed on the via layer250. The organic light-emitting diode OLED includes the pixel electrode281, an intermediate layer 283 including an organic emission layer, andan opposite electrode 285. In such an embodiment, the organiclight-emitting diode OLED may further include a pixel defining layer270.

The pixel electrode 281 and/or the opposite electrode 285 may betransparent electrodes or reflective electrodes. In an exemplaryembodiment, where the pixel electrode 281 and/or the opposite electrode285 are transparent electrodes, the pixel electrode 281 and/or theopposite electrode 285 may include indium tin oxide (“ITO”), indium zincoxide (“IZO”), ZnO, or In₂O₃. In an exemplary embodiment, where thepixel electrode 281 and/or the opposite electrode 285 are reflectiveelectrodes, the pixel electrode 281 and/or the opposite electrode 285may each include a reflective layer including Ag, Mg, Al, Pt, Pd, Au,Ni, Nd, Ir, Cr, or a compound thereof, and a transparent layer includingITO, IZO, ZnO, or In₂O₃. In some exemplary embodiments, the pixelelectrode 281 or the opposite electrode 285 may have an ITO/Ag/ITOstructure.

The intermediate layer 283 disposed between pixel electrode 281 and theopposite electrode 285 may include an organic emission layer.

Alternatively, the intermediate layer 283 includes the organic emissionlayer, and may further include at least one of a hole injection layer(“HIL”), a hole transport layer (“HTL”), an electron transport layer(“ETL”), and an electron injection layer (“EIL”). However, exemplaryembodiments are not limited thereto. Alternatively, the intermediatelayer 283 includes the organic emission layer and may further includevarious functional layers.

A spacer 290 (see FIG. 3) may be further disposed on the pixel defininglayer 270. The spacer 290 may protrude upward from the pixel defininglayer 270, and may be disposed in a way such that displaycharacteristics is effectively prevented from being degraded due toexternal shock.

In an exemplary embodiment, the spacer 290 may be formed through a samemanufacturing process using a same material as those of the pixeldefining layer 270. In such an embodiment, the pixel defining layer 270and the spacer 290 may be formed simultaneously by adjusting an exposureamount through an exposure process using a half-tone mask. However, oneor more exemplary embodiments are not limited thereto, alternatively,the pixel defining layer 270 and the spacer 290 may be sequentially orseparately formed. In another alternative exemplary embodiment, thepixel defining layer 270 and the spacer 290 may be provided asindependent structures from each other by using different materials.

Hereinafter, the cross-sectional structure of the second regions Dlocated at opposite sides of the first region B will be described indetail with reference to FIG. 3.

In an exemplary embodiment, as shown in FIG. 3 and as described above,the buffer layer 110, the gate insulating layer 210, gate lines GL, theinter-insulating layer 230, and the data lines SD are sequentiallydisposed on the substrate 100.

FIG. 3 shows that the buffer layer 110 is disposed on the substrate 100,but not being limited thereto. Alternatively, the buffer layer 110 maybe omitted and the gate insulating layer 210 may be disposed directly onthe substrate 100.

Alternatively, the buffer layer 110 may include an inorganic material,and may be selectively formed only in the second regions D, not in thefirst region B.

Alternatively, the gate insulating layer 210 and the inter-insulatinglayer 230 may include an inorganic material. In an exemplary embodiment,the gate insulating layer 210 and the inter-insulating layer 230 are notformed on the first region B at which the flexible display apparatus1000 bends, but may be patterned only in the second regions D on thesubstrate 100.

An inorganic layer may have a single-layered structure or a stackedstructure including metal oxide or metal nitride. Although the inorganiclayer may prevent infiltration of oxygen or moisture, stress appliedthereto may not be effectively reduced.

Thus, according to an exemplary embodiment of the flexible displayapparatus 1000, the gate insulating layer 210 and the inter-insulatinglayer 230 including the inorganic material are substantially entirelyremoved from or not provided in the first region B by which the flexibledisplay apparatus 1000 bends, and accordingly, the stress may be reducedand flexibility may be improved.

The data lines SD may be arranged on the inter-insulating layer 230. Inan exemplary embodiment, the data lines SD may be arranged on the firstregion B to connect the gate lines GL of the second regions D at theopposite sides of the first region B to each other.

In such an embodiment, the data lines SD may be disposed directly on thesubstrate 100 in the first region B, so that an upper surface of thesubstrate 100 directly contacts the data lines SD.

In such an embodiment where the data lines SD connect the gate lines GLof the two second regions D that are separate from each other, signalsmay be transferred between the second regions D.

Alternatively, the data lines SD may include Al. Since the Al has highflexibility, the data lines SD may be formed to be curved on thesubstrate 100 in the first region B between the gate lines GL of the twosecond regions D.

In such an embodiment, when the first region B is bent, stress may notlargely affect the data lines SD having high flexibility and the datalines SD are not likely to be shorted, and thus, the flexibility may beimproved.

The via layer 250 may be disposed on the data lines SD.

The via layer 250 may include an organic material, and may be formedentirely on the first region B to cover the data lines SD.

Since the via layer 250 including the organic material is disposed onthe data lines SD on the first region B that is bendable, the via layer250 may absorb stress applied to the first region B and providesflexibility.

Therefore, according to an exemplary embodiment of the flexible displayapparatus 1000, the inorganic layer on the substrate 100 is reduced orremoved in the first region B and the organic layer and the data linesSD having high flexibility are only disposed on the substrate 100 in thefirst region B. Thus, in such an embodiment, the stress applied to thefirst region B may be reduced, and crack may not occur even when thebending is repeatedly performed.

The pixel defining layer 270 for defining pixel regions and the spacer290 may be sequentially disposed on the via layer 250.

In some exemplary embodiment, the pixel defining layer 270 and thespacer 290 may both include an organic material, and as shown in FIG. 3,the pixel defining layer 270 and the spacer 290 may be omitted from thefirst region B and may be selectively patterned in the second region D.

Alternatively, the flexible display apparatus 1000 may further include ametal dam DAM disposed at an edge of each second region D to be spacedapart from the data lines SD with a predetermined distance.

In an exemplary embodiment, the metal dam DAM may be patterned at thesame time when the data lines SD are formed by using the same materialas that of the data lines SD, and may be formed at each of the secondregions D located at the opposite sides of the first region B.

The via layer 250, the pixel defining layer 270 and the spacer 290 maybe sequentially disposed on the metal dam DAM.

In such an embodiment, where the metal dam DAM is disposed on theinter-insulating layer 230, and the via layer 250, the pixel defininglayer 270 and the spacer 290 are disposed on the metal dam DAM, the edgeof the second region D is relatively higher.

In such an embodiment, since the edge of the second region D isrelatively higher than the first region B and the other portion of thesecond region D, on which the metal dam DAM is not formed, infiltrationof moisture into the organic light-emitting diode OLED that is locatedat an inner portion of the second region D may be effectively prevented.

The third region I may be between the metal dam DAM and an end portionof the data lines SD.

In such an embodiment, a moisture transferring path is not formed in thethird region I, and the via layer 250, the pixel defining layer 270 andthe spacer 290 including the organic material may not be formed on thethird region I.

In such an embodiment, the via layer 250, the pixel defining layer 270and the spacer 290 may be patterned in the second region D, except forthe third region I.

Although the layer including the organic material relives the stress andimproves the flexibility, a path for transferring moisture or oxygen maybe provided due to the organic material.

Therefore, in an exemplary embodiment, layers including the organicmaterial are substantially entirely removed from the third region I notto provide the path of transferring the moisture, and then, onlyinorganic layers, e.g., the gate insulating layer 210, theinter-insulating layer 230 and the gate lines GL, may be formed on thesubstrate 100 in the third region I.

In an exemplary embodiment of the flexible display apparatus 1000, theinorganic layers, e.g., the gate insulating layer 210 and theinter-insulating layer 230, are substantially entirely removed from thefirst region B and formed only on the second region D, and the organiclayer, e.g., the via layer 250, is substantially entirely removed fromthe third region I to be formed only in the first region B and thesecond region D except the third region I.

In such an embodiment, the organic layers, e.g., the pixel defininglayer 270 and the spacer 290, may be patterned within the second regionD. In such an embodiment, the pixel defining layer 270 and the spacer290 may be substantially entirely removed from the third region I and apart of the second region D, which is located on an outer portion of thethird region I, and may be patterned on the metal dam DAM and the secondregion D inside the metal dam DAM.

Accordingly, in such an embodiment, the pixel defining layer 270 and thespacer 290 may not overlap the region from the first region B to thethird region I, and may be patterned only in the third region I, thatis, on the metal dam DAM and the second region D inside the metal damDAM.

Accordingly, the inorganic layer may not be formed on the first region Bthat is the bending portion, and then, the data lines SD and the vialayer 250 that is the organic layer are formed only on the first regionB. Thus, the stress may be relieved and the flexibility is improved.

In such an embodiment, the organic layers are not formed on the edge ofthe second region D, on which the organic light-emitting diode OLED isformed, and then, the third region I, on which the inorganic layers,e.g., the gate insulating layer 210, the inter-insulating layer 230 andthe gate lines GL, are only formed, is located at the edge of the secondregion D. Accordingly, the path through which the moisture transfersinto the organic light-emitting diode OLED from the outside may beblocked.

In such an embodiment, the metal dam DAM that is spaced apart from thedata lines SD with a predetermined distance is disposed on the edge ofthe second region D including the organic light-emitting diode OLED, andthe via layer 250, the pixel defining layer 270 and the spacer 290 aresequentially disposed on the metal dam DAM. Thus, the edge of the secondregion D is relatively higher than peripheral regions, and thus, theinfiltration of the moisture from the outside may be effectivelyprevented.

In an exemplary embodiment, the flexible display apparatus 1000 mayinclude a thin film encapsulation portion 300 a on an upper portion ofthe display unit 200 to completely seal the display unit 200, to therebyprotect the display unit 200 against external moisture or oxygen.

The thin film encapsulation portion 300 a may be disposed on the displayunit 200, and opposite ends of the thin film encapsulation portion 300 amay be coupled, e.g., adhered, to the substrate 100.

In some exemplary embodiments, the thin film encapsulation portion 300 ahas a structure in which a plurality of thin film layers are stacked,that is, inorganic layers and organic layers may be alternately stacked.

The inorganic layers may effectively prevent the infiltration of oxygenor moisture, and the organic layers may absorb stress applied to theinorganic layer to grant the flexibility.

The inorganic layer may be a single layer or a stacked layer includingmetal oxide or metal nitride. The inorganic layers may include one ofSiNx, Al₂O₃, SiO₂, and TiO₂.

The organic layer may include a polymer, and may be a single layer or astacked layer including, for example, one of polyethylene terephthalate,polyimide, polycarbonate, epoxy, polyethylene, and polyacrylate. In anexemplary embodiment, the organic layers may include polyacrylate. Inone exemplary embodiment, for example, the organic layer may include apolymerized monomer composition including diacrylate-based monomer andtriacrylate-based monomer. The monomer composition may further includemonoacrylate-based monomer. Also, the monomer composition may furtherinclude a well-known photoinitiator such as trimethyl benzoyl diphenylphosphine oxide (“TPO”), but exemplary embodiments are not limitedthereto.

In an exemplary embodiment, the inorganic layer is removed only from thefirst region B that is the bending portion, but is not limited thereto.In an alternative exemplary embodiment, the second region D may includea region from which the inorganic layer is removed as in the firstregion B.

In an exemplary embodiment, the second region D may also have a bendingregion, and in the bending region, the inorganic layer may be removed torelieve the stress and improve the flexibility within a range ofmaintaining connections between wires. Therefore, the region from whichthe inorganic layer is removed is not limited to the first region Bbetween the two second regions D, as described above.

FIG. 4 is a cross-sectional view of a flexible display apparatus 2000according to an alternative exemplary embodiment, based on the firstregion B. The same or like elements shown in FIG. 4 have been labelledwith the same reference characters as used above to describe theexemplary embodiments of the flexible display apparatus in FIGS. 1 to 3,and any repetitive detailed description thereof will hereinafter beomitted or simplified.

In such an embodiment, as shown in FIG. 4, the inorganic layers, e.g.,the gate insulating layer 210 and the inter-insulating layer 230, areremoved in the first region B, and may be disposed entirely in thesecond region D on the substrate 100.

In such an embodiment, the data lines SD may be directly arranged on thesubstrate 1000 in the first region B.

The gate lines GL may be disposed on the gate insulating layer 210 andunder the inter-insulating layer 230 in the second region D.

The data lines SD may be disposed on the inter-insulating layer 230, andthe data lines SD may connect the gate lines GL of the two secondregions D that are located at the opposite sides of the first region B.

The metal dam DAM that is spaced apart from the data lines SD with apredetermined distance may be formed at an edge of the second region D.The metal dam DAM may be patterned at the same time when the data linesSD are patterned by using the same material as the data lines SD.

The via layer 250 may be disposed on the data lines SD. The via layer250 may include an organic layer that may be formed on the data lines SDentirely in the first region and may be patterned within the secondregion D.

In such an embodiment, the via layer 250 is substantially entirelyremoved from the third region I that is between the data lines SD andthe metal dam DAM, and may be formed on (or disposed to overlap whenviewed from a plan view in a thickness direction of the flexible displayapparatus) the first region B and the second region D except the thirdregion I.

The pixel defining layer 270 and the spacer 290 including the organicmaterial may be sequentially formed on the via layer 250, and may bepatterned on the metal dam DAM and inside the metal dam DAM on thesecond region D. That is, the pixel defining layer 270 and the spacer290 may not be formed on the third region I, a portion of the secondregion D outside the third region I, and the first region B.

Accordingly, the inorganic layers are substantially entirely removedfrom the first region B that is the bending portion, and the data linesSD and the organic layer, that is, the via layer 250, are only formed onthe first region B so that the stress applied to the first region B maybe relieved and the flexibility may be improved.

In such an embodiment, the organic layers are substantially entirelyremoved from the edge of the second region D, on which the organiclight-emitting diode OLED is formed, and then, the third region I onwhich the inorganic layers, e.g., the gate insulating layer 210, theinter-insulating layers 230 and the gate lines GL are only formed, islocated at the edge of the second region D. Accordingly, the paththrough which the moisture transfers from the outside toward the organiclight-emitting diode OLED may be blocked.

In such an embodiment, the metal dam DAM that is spaced apart from thedata lines SD with a predetermined distance is disposed on the edge ofthe second region D, on which the organic light-emitting diode OLED isformed, and the via layer 250, the pixel defining layer 270 and thespacer 290 are sequentially disposed on the metal dam DAM. Thus, theedge of the second region D is relatively higher and performs as a damfor preventing infiltration of the moisture from the outside.

According to an exemplary embodiment, the flexible display apparatus2000 may further include a thin film encapsulation portion 300 b on thedisplay unit 200 to completely seal the display unit 200, to therebyprotect the display unit 200 against the external moisture or oxygen.

The thin film encapsulation portion 300 b may have a structure, in whicha plurality of thin film layers are stacked one on another, for example,inorganic layers and organic layers may be alternately stacked.

The thin film encapsulation portion 300 b in the flexible displayapparatus 2000 may be disposed on the entire surface of the substrate100, except the first region B.

The thin film encapsulation portion 300 b has a predetermined thickness,and thus, the thin film encapsulation portion 300 b is substantiallyentirely removed from the first region B, which is the bending portion,so that the first region B may be relatively thin in thickness.Therefore, the stress may be relieved and a possibility of occurringcrack in the flexible display apparatus 2000 may be reduced.

In some other exemplary embodiments, the inorganic layers in the thinfilm encapsulation portion 300 b, in which the organic layers and theinorganic layers are alternately stacked, may be disposed on the firstregion B so that the organic layers remain only on the first region B.Since the organic layer relieves the stress and improves theflexibility, the stress applied to the first region B may be relievedprovided that the organic layers are formed on the via layer 250 of thefirst region B.

FIG. 5 is a cross-sectional view of a flexible display apparatus 3000according to another alternative exemplary embodiment, based on thefirst region B. The same or like elements shown in FIG. 5 have beenlabelled with the same reference characters as used above to describethe exemplary embodiments of the flexible display apparatus in FIGS. 1to 3, and any repetitive detailed description thereof will hereinafterbe omitted or simplified.

In an exemplary embodiment of the flexible display apparatus 3000 shownin FIG. 5, the inorganic layers, e.g., the gate insulating layer 210 andthe inter-insulating layer 230, are substantially entirely removed fromthe first region B, and may be formed entirely in the second region D onthe substrate 100.

In such an embodiment, the data lines SD are disposed directly on thesubstrate 100 in the first region B, and the gate lines GL may bedisposed on the gate insulating layer 210 and under the inter-insulatinglayer 230 in the second region D.

The data lines SD may be disposed on the inter-insulating layer 230, andthe data lines SD are disposed entirely on the first region B to connectthe gate lines GL of the two second regions D located at the oppositesides of the first region B.

The metal dam DAM that is spaced apart from the data lines SD with apredetermined distance may be disposed at the edge of the second regionD. The metal dam DAM may be patterned at the same time when forming thedata lines SD by using the same material as that of the data lines SD.

The via layer 250 may be disposed on the data lines SD. The via layer250 may include an organic layer, and may be disposed on the data linesSD entirely in the first region B and may be patterned in the secondregion D.

In such an embodiment, the via layer 250 is substantially entirelyremoved from the third region I that is between the data lines SD andthe metal dam DAM, and may be formed on the first region B and thesecond region D except the third region I.

The pixel defining layer 270 and the spacer 290 including the organicmaterial may be sequentially disposed on the via layer 250. Like the vialayer 250, the pixel defining layer 270 and the spacer 290 may bedisposed to overlap the first region B and the second region D exceptthe third region I.

Alternatively, the via layer 250, the pixel defining layer 270 and thespacer 290 may be all include the organic material, and may besequentially disposed on the data lines SD in the first region B that isthe bending portion.

In such an embodiment, since the organic layers, e.g. the via layer 250,the pixel defining layer 270 and the spacer 290 for relieving the stressand improving the flexibility, are disposed on the data lines SD in thefirst region B, the stress may not accumulate and crack may not occureven if the first region B is repeatedly bent.

In such an embodiment, the organic layers, e.g., the via layer 250, thepixel defining layer 270 and the spacer 290, are substantially entirelyremoved from the third region I so that the via layer 250, the pixeldefining layer 270 and the spacer 290 are only disposed or patterned inthe second region D except the third region I.

Accordingly, the organic layers are all removed in the third region I,and only the inorganic layers, e.g., the gate insulating layer 210, thegate lines GL and the inter-insulating layer 230, are disposed on thesubstrate 100, such that the path of transferring moisture into thesecond region D may be blocked.

Alternatively, the thin film encapsulation portion 300 b, in which theinorganic layers and the organic layers are alternately stacked, may bedisposed on the display unit 200 to completely seal the display unit 200against the external moisture or oxygen.

In an exemplary embodiment of the flexible display apparatus 3000, thethin film encapsulation portion 300 b may be disposed on the substrate100, except the first region B.

Since the thin film encapsulation portion 300 b has a predeterminedthickness, the thin film encapsulation portion 300 b is substantiallyentirely removed from the first region B that is the bending portion torelieve the stress and to reduce the possibility of generating crack.

FIG. 6 is a cross-sectional view of a flexible display apparatus 4000according to another alternative exemplary embodiment, based on thefirst region B. The same or like elements shown in FIG. 6 have beenlabelled with the same reference characters as used above to describethe exemplary embodiments of the flexible display apparatus in FIGS. 1to 4, and any repetitive detailed description thereof will hereinafterbe omitted or simplified.

In an exemplary embodiment of the flexible display apparatus 4000, asshown in FIG. 6, the inorganic layers, e.g., the gate insulating layer210 and the inter-insulating layer 230, are substantially entirelyremoved from the first region B, and may be disposed entirely in thesecond region D on the substrate 100.

The gate lines GL may be disposed on the gate insulating layer 210 andunder the inter-insulating layer 230, and the data lines SD are disposedon the inter-insulating layer 230 to contact the gate lines GL.

The via layer 250 may be disposed on the data lines SD. The via layer250 may include an organic layer, and may be patterned in the secondregion D. In such an embodiment, the via layer 250 including the organiclayer may be disposed on the first region B.

As will be described later, since the data lines SD contact the pixelelectrode 281 located thereon, the via layer 250 may be patterned in thesecond region D to expose at least a part of the data lines SD.

In an exemplary embodiment of the flexible display apparatus 4000, thegate insulating layer 210, the gate lines GL, the inter-insulating layer230 and the data lines SD are not formed in the first region B, andthus, the via layer 250 may be disposed directly on the substrate 100.

The pixel electrode 281 may be disposed on the via layer 250.

Alternatively, the pixel electrode 281 may be disposed on the via layer250 entirely in the first region B. In an exemplary embodiment, sincethe pixel electrode 281 contacts the data lines of the second regions Dlocated at the opposite sides of the first region B, the pixel electrode281 may connect the lines of the two second regions D to each other.

The via layer 250 is patterned or has a patterned structure to expose apart of the data lines SD as described above, and the pixel electrode281 may be disposed on the data lines SD to cover the ends of the vialayer 250. However, one or more exemplary embodiments are not limitedthereto, and the pixel electrode 281 may be formed in another way suchthat the data lines SD in adjacent second regions D may be connected toeach other therethrough.

The pixel defining layer 270 may be disposed on the pixel electrode 281.

Alternatively, the pixel defining layer 270 may include an organiclayer, and may be disposed on the pixel electrode 281 entirely in thefirst region B.

The pixel defining layer 270 may be patterned so that a part of thepixel defining layer 270 may be removed at the edge of the second regionD.

On the region where the via layer 250 is removed, the pixel defininglayer 270 may be also removed. Then, such a region where the via layer250 and the pixel defining layer 270 are removed in the second region Dmay define the third region I that removes the path of transferring themoisture and locates at the edge of the second region D.

In such an embodiment, as shown in FIG. 6, the inorganic layers, e.g.,the gate insulating layer 210, the inter-insulating layer 230, the gatelines GL, the data lines SD and the pixel electrode 281 that includemetal may be formed only in the third region I on the substrate 100.

In the third region I including a part of the data lines SD, the organiclayers are removed, and thus, the movement of the moisture and oxygeninto the second region D via the organic layers may be prevented.

The spacer 290 may be disposed on the pixel defining layer 270, and thespacer 290 is substantially entirely removed from the first region B andthe third region I and partially patterned on the second region D exceptthe third region I.

The spacer 290 may include the organic layer, and although not shown inFIG. 6, the spacer 290 may be selectively formed on the pixel defininglayer 270 in the first region B.

In an exemplary embodiment of the flexible display apparatus 4000, theorganic layers, e.g., the via layer 250, the pixel defining layer 270and the pixel electrode 281 between the via layer 250 and the pixeldefining layer 270, are formed only in the first region B on thesubstrate 100, and thus, the flexibility may be maximized. In such anembodiment, minimum metal wires are provided to connect the linesbetween the two second regions D, and thus, the stress may be relivedand the possibility of generating crack may be reduced even when thefirst region B is bent repeatedly.

In an exemplary embodiment, the thin film encapsulation portion 300 b,in which the inorganic layers and the organic layers are alternatelystacked, may be disposed on the display unit 200 to completely seal thedisplay unit 200 against the external moisture or oxygen.

In such an embodiment of the flexible display apparatus 4000, the thinfilm encapsulation portion 300 b may be disposed entirely on thesubstrate 100 except the first region B.

Since the thin film encapsulation portion 300 b has a predeterminedthickness, the thin film encapsulation portion 300 b is substantiallyentirely removed from the first region B that is the bending portion torelieve the stress and to reduce the possibility of generating crack.

FIG. 7 is a cross-sectional view of a flexible display apparatus 5000according to another alternative exemplary embodiment, based on thefirst region B. The same or like elements shown in FIG. 7 have beenlabelled with the same reference characters as used above to describethe exemplary embodiments of the flexible display apparatus in FIGS. 1to 4, and any repetitive detailed description thereof will hereinafterbe omitted or simplified.

The flexible display apparatus 5000 shown in FIG. 7 is similar to theflexible display apparatus 2000 illustrated in FIG. 4, and thus,differences of the flexible display apparatus 5000 from the flexibledisplay apparatus 2000 will be described below.

In an exemplary embodiment, as shown in FIG. 7, the thin filmencapsulation portion 300 b may be disposed on the display unit 200 tocompletely seal the display unit 200 against the external moisture oroxygen.

The thin film encapsulation portion 300 b may have a structure in whicha plurality of thin film layers, e.g., inorganic layers and organiclayers, may be stacked alternately one on another.

In an exemplary embodiment, the thin film encapsulation portion 300 bmay be disposed on the entire surface of the substrate 100 except thefirst region B.

Since the thin film encapsulation portion 300 b has a predeterminedthickness, the thin film encapsulation portion 300 b is substantiallyentirely removed from the first region B that is the bending portion torelieve the stress and to reduce the possibility of generating crack.

In an exemplary embodiment, since the first region B, on which the thinfilm encapsulation portion 300 b is removed, may be more vulnerable tothe external moisture or oxygen than the second region D, a moldingportion 400 may be disposed on the first region B after bending thefirst region B.

In such an embodiment, where the molding portion 400 may be disposed onthe display unit 200 in the first region B, on which the thin filmencapsulation portion 300 b is removed, the molding portion 400 mayinclude a waterproof coating agent.

Accordingly, in such an embodiment of the flexible display apparatus5000, the stress applied to the first region B is relieved even when athickness of the first region B is reduced and the first region B isbent repeatedly. In such an embodiment, where the molding portion 400 isprovided, infiltrating the external moisture or oxygen into the firstregion B is effectively prevented, and thus, occurrence of crack may beeffectively prevented and the organic light-emitting diode OLED may beprotected at the same time.

FIG. 8 is a cross-sectional view of the flexible display apparatus 6000according to another alternative exemplary embodiment, based on thefirst region B. The same or like elements shown in FIG. 8 have beenlabelled with the same reference characters as used above to describethe exemplary embodiments of the flexible display apparatus in FIGS. 1to 4, and any repetitive detailed description thereof will hereinafterbe omitted or simplified.

Since the flexible display apparatus 6000 shown in FIG. 8 is similar tothe flexible display apparatus 2000 illustrated in FIG. 4, differencesof the flexible display apparatus 6000 from the flexible displayapparatus 2000 will be described below.

An exemplary embodiment of the flexible display apparatus 6000 mayfurther include a touch screen panel (“TSP”) wire or line 510 on thethin film encapsulation portion 300 b.

The TSP line 510 is a line for sensing a touch of a user, and is notdisconnected in the first region B to be connected between the twosecond regions D at the opposite sides of the first region B.

If the TSP line 510 is stacked at the same location as the data line SDdisposed under the TSP line 510, a parasitic capacitor may occur.Therefore, the data lines SD and the TSP line 510 above the data linesSD may not be arranged in parallel with each other.

In such an embodiment, a TSP protective organic layer 530 may bedisposed on the TSP line 510 to protect the TSP line 510 on the thinfilm encapsulation portion 300 b. The TSP protective organic layer 530may completely seal the TSP line 510 and the structures under the TSPline 510. In such an embodiment, since the organic layer providesflexibility, the TSP protective organic layer 530 may be disposed on theTSP line 510 in the first region B.

The TSP protective organic layer 530 may include at least one selectedfrom polyacrylates resin, epoxy resin, phenolic resin, polyamides resin,polyimides resin, unsaturated polyesters resin, poly phenylenethersresin, and poly phenylenesulfides resin.

According to exemplary embodiments, the stress applied to the flexibledisplay apparatus may be relived even when the flexible displayapparatus is bent by a predetermined angle or greater.

It should be understood that exemplary embodiments described hereinshould be considered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each exemplaryembodiment should typically be considered as available for other similarfeatures or aspects in other exemplary embodiments.

While one or more exemplary embodiments have been described withreference to the figures, it will be understood by those of ordinaryskill in the art that various changes in form and details may be madetherein without departing from the spirit and scope as defined by thefollowing claims.

What is claimed is:
 1. A flexible display apparatus comprising: asubstrate including a first area, a second area, and a bending region; afirst insulating layer on the substrate; a second insulating layer onthe first insulating layer in the first area; a third insulating layeron the first insulating layer in the second area; a first signal line onthe second insulating layer in the first area; a second signal line onthe third insulating layer in the second area; a fourth insulating layeron the first signal line in the first area; a fifth insulating layer onthe second signal line in the second area; a third signal line on thesubstrate in the first area, the second area and the bending region; anda first organic material layer in the bending region, the first organicmaterial layer is apart from a via layer in the first area and in thesecond area, wherein the first insulating layer is between the substrateand the third signal line in the first area or the second area in a topplan view in a thickness direction of the substrate.
 2. A flexibledisplay apparatus comprising: a substrate including a first area, asecond area, and a bending region; a first insulating layer on thesubstrate; a second insulating layer on the first insulating layer inthe first area; a third insulating layer on the first insulating layerin the second area; a first signal line on the second insulating layerin the first area; a second signal line on the third insulating layer inthe second area; a fourth insulating layer on the first signal line inthe first area; a fifth insulating layer on the second signal line inthe second area; a third signal line on the substrate in the first area,the second area and the bending region; a first organic material layerin the bending region, the first organic material layer is apart from avia layer in the first area and in the second area; and display elementson the first area; wherein the display elements are not in the secondarea, and wherein the first insulating layer is between the substrateand the third signal line in the first area or the second area in a topplan view in a thickness direction of the substrate.
 3. A flexibledisplay apparatus comprising: a substrate including a first area, asecond area, and a bending region; a first insulating layer on thesubstrate; a second insulating layer on the first insulating layer inthe first area; a third insulating layer including on the firstinsulating layer in the second area; a first signal line including afirst portion on the second insulating layer in the first area; a secondsignal line including a second portion on the third insulating layer inthe second area; a fourth insulating layer on the first signal line inthe first area; a fifth insulating layer on the second signal line inthe second area; a third signal line including a third portion and afourth portion on the substrate in the first area, the second area andthe bending region; a first organic material layer in the bendingregion, the first organic material layer is apart from a via layer inthe first area and in the second area; and display elements on the firstarea; wherein the first insulating layer is between the substrate andthe third signal line in the first area or the second area in a top planview in a thickness direction of the substrate, wherein the fourthinsulating layer includes a first contact hole and the fifth insulatinglayer includes a second contact hole, wherein the third portion of thethird signal line is disposed on the first portion of the first signalline in the first area, wherein the fourth portion of the third signalline is disposed on the second portion of the second signal line in thesecond area, wherein the third portion of the third signal line and thefirst portion of the first signal line overlap the first contact hole ina plan view, wherein the fourth portion of the third signal line and thesecond portion of the second signal line overlap the second contact holein the plan view, and wherein the display elements are not in the secondarea.